Cosmetically hidden electrostatic discharge protection structures

ABSTRACT

Cosmetically hidden electrostatic discharge (ESD) protection structures and systems are disclosed herein. In one example, an electronic device is provided. The electronic device includes an integrated circuit and an ESD protection structure positioned at least partially around a perimeter of the integrated circuit, where the ESD protection structure is configured to protect the integrated circuit from an electrostatic discharge strike. The electronic device further includes a concealing layer positioned on a surface of the ESD protection structure, the concealing layer configured to at least partially conceal the ESD protection structure from view.

DESCRIPTION OF THE DRAWING FIGURES

For a more complete understanding of the disclosure, reference is madeto the following detailed description and accompanying drawing figures,in which like reference numerals may be used to identify like elementsin the figures.

FIG. 1 depicts an example of an integrated circuit having electrostaticdischarge protection.

FIG. 2 depicts an example cross-section of an integrated circuit havingan electrostatic discharge protection structure.

FIG. 3 depicts an additional example of a cross-section of an integratedcircuit with an electrostatic discharge protection structure.

FIG. 4 is a block diagram of a computing environment in accordance withone example for implementation of the disclosed sensor, input device, oraspects thereof.

FIG. 5 is an illustration of an environment in an example implementationthat is operable to employ the cosmetically hidden electrostaticdischarge (ESD) protection structures described herein.

While the disclosed systems and methods are susceptible of embodimentsin various forms, specific embodiments are illustrated in the drawing(and are hereafter described), with the understanding that thedisclosure is intended to be illustrative, and is not intended to limitthe claim scope to the specific embodiments described and illustratedherein.

DETAILED DESCRIPTION

Disclosed herein are electronic devices and systems having cosmeticallyhidden electrostatic discharge protection structures.

Electrostatic discharge (ESD) refers to the flow of electricity betweentwo electrically charged objects caused by contact, an electrical short,or dielectric breakdown. An ESD may occur when differently chargedobjects are brought close together or when the dielectric between thembreaks down, potentially creating a spark. The ESD may cause failure ofan electronics component such as an integrated circuit. Therefore,electronics manufacturers may install an ESD protection structure ordevice near the electronics component to divert the electrostaticdischarge of an approaching body to the ground.

In certain electronic devices, a metallic frame or bezel may bepositioned around the sensor to protect the sensor against an ESDstrike. It may be undesirable for the ESD protection structure to bevisible to the user. Therefore, as disclosed herein, examples areprovided for concealing the ESD protection structure while maintainingthe desired path of an electrostatic discharge through the protectionstructure, therein protecting the electronics component (e.g., anintegrated circuit) and eliminating the need for a metallic frame orbezel.

Such concealed or cosmetically hidden ESD structures may be incorporatedinto any number of electronic devices or input devices of an electronicdevice. For example, the ESD protection structure may be incorporatedinto personal computers, server computers, tablet or other handheldcomputing devices, laptop or mobile computers, communications devicessuch as mobile phones, multiprocessor systems, microprocessor-basedsystems, set top boxes, programmable consumer electronics, network PCs,minicomputers, mainframe computers, or audio or video media players. Incertain examples, the cosmetically hidden ESD structure may beincorporated within a wearable electronic device, wherein the device maybe worn on or attached to a person's body or clothing. The wearabledevice may be attached to a person's shirt or jacket; worn on a person'swrist, ankle, waist, or head; or worn over their eyes or ears. Suchwearable devices may include a watch, heart-rate monitor, activitytracker, or head-mounted display.

Non-limiting examples of cosmetically hidden ESD protection structuresare described in greater detail below.

Exemplary Configurations of ESD Structure

In certain examples, an ESD protection structure is configured toprotect an integrated circuit within an electronic device from undesiredelectrostatic discharges. In some examples, the integrated circuit is asensor integrated circuit. In particular, the sensor integrated circuitmay be a fingerprint sensor integrated circuit.

FIG. 1 depicts a non-limiting example of an electronic device 100 havingan ESD protection structure. In this example, the electronic device 100includes a fingerprint sensor integrated circuit 102 and an ESDprotection structure 104 surrounding the perimeter of the sensor IC 102.The sensor IC 102 and ESD protection structure 104 are positioned on asubstrate 106. An extension 108 is positioned on the surface of thesubstrate connecting the ESD protection structure 104 to ground with apin/plug connector 110.

In this example, when a user of the electronic device 100 contacts orapproaches the surface of the fingerprint sensor IC 102 with theirfinger, the ESD protection structure 104 is configured to control theroute of an ESD strike, therein protecting the sensor IC 102 from anelectrostatic discharge from the user's finger. This is importantbecause the ESD protection structure 104 prevents an electrostaticdischarge from flowing through the sensor IC 102 and potentiallydamaging or shorting the sensor IC 102, and render it inoperable. TheESD protection structure 104 also eliminates the need for a metallicframe or bezel to surround the sensor IC 102.

The ESD protection structure 104 may be made of a conductive material.For example, the conductive material may include one or more metals suchas gold, silver, copper, aluminum, zinc, or nickel. In some examples,the ESD protection structure 104 is a metal plated trace. In oneparticular example, the ESD protection structure 104 is a gold platedtrace.

In certain examples, the protection structure includes at least onesegment positioned around at least a portion of the sensor IC. Forexample, as depicted in FIG. 1, the ESD protection structure 104 is asingle, continuous trace surrounding the entire perimeter of the sensorIC 102. In an alternative example, the protection structure includes onesegment positioned around less than the entire perimeter of the sensorIC. In another example, the protection structure includes multiplesegments positioned around less than the entire perimeter of the sensorIC.

The material and the positioning of ESD protection structure around atleast a portion of the sensor IC is configured to provide protection forthe electrostatic discharge strike to travel through the protectionstructure, regardless of where the user's finger touches or approachesthe sensor IC 102 (e.g., upper-left corner, upper edge, upper-rightcorner, right edge, lower-right corner, lower edge, lower-left corner,left edge, or center of the sensor IC). In other words, the material andlocation of the ESD protection structure is configured to provide adielectric breakdown path for an electronic discharge strike which isless than the dielectric breakdown path of an electronic dischargestrike traveling through the sensor IC (e.g., from the surface to theopposite side or base connected to the substrate).

FIG. 2 depicts an example cross-section of an electronic device 200having a sensor integrated circuit 202 and an electrostatic discharge(ESD) protection structure 204 surrounding at least a portion of thesensor IC 202. The sensor IC 202 is affixed to a substrate 206 via aconnecting layer 208 (e.g., solder).

In this non-limiting example, the substrate 206 includes multiplelayers, e.g., a flexible print circuit layer 210, a riser layer 212, anda stiffener or backing layer 214. The riser layer 212 may be a printedcircuit board or glass-reinforced epoxy laminate sheet such as FR-4. Theheight of the riser layer (in the z-direction) may be configured suchthat the surface 222 of the sensor IC 202 is at a same height as anothercomponent of the electronic device 200 (e.g., an input component such asa trackpad or QWERTY keyboard). The stiffener layer 214 may be a metallayer configured to provide a rigid backing or support to the electronicdevice at the sensor IC. The metal layer may include stainless steel oraluminum, for example.

As depicted in FIG. 2, the ESD protection structure 204 is positioned onthe substrate 206 as well, specifically the flexible print circuit layer210 of the substrate 206. As such, the ESD protection structure 204 andsensor IC 202 are co-planar (or positioned on a same plane). The ESDprotection structure 204 is connected to a ground via an extension 216of the ESD protection structure. The extension 216 may also be connectedor affixed to the surface of the substrate 206 (e.g., flexible printcircuit 210). The extension 216 may be made of the same or a differentconductive material as the ESD protection structure 204. Thisconfiguration allows for controlling the route of current that flows inan ESD strike because the strike is dissipated to ground in a safe routewithout damaging the sensor IC 202.

A concealing layer 218 is positioned over the surface of the ESDprotection structure 204. The concealing layer 218 is configured to atleast partially conceal or hide the ESD protection structure 204 fromthe view of the user of the electronic device 200. Additionally, theconcealing layer 218 may provide a uniform color or pattern in the areaof the electronic device 200 at or surrounding the sensor IC 202. Inother words, any undesired pattern or color of the ESD protectionstructure 204 (e.g., the color of a metal trace) may be concealed withthe concealing layer 218 to appear uniform in color with the surroundingelectronic components.

The concealing layer 218 may be made of a conductive material. In oneexample, the concealing layer 218 is a paint layer or a carbon screen.The paint layer or carbon screen may be conductive. For example, thepaint layer may be a latex or acrylic paint having a conductivecomposition (e.g., a carbon composition such as graphite powder). Thepaint layer or carbon screen may be configured to match the color or besimilar in color to the sensor IC surface color and/or the color of anadjacent layer of the electronic device 200.

The concealing layer 218 may have a thickness or height in thez-direction such that the dielectric breakdown path for the ESDprotection structure 204 and concealing layer 218 remains less than thedielectric breakdown path for the sensor IC 202. In other words, theheight of the concealing layer 218 (combined with the type of materialof the concealing layer 218) should not be configured such that apotential electrostatic discharge strike would travel through the sensorIC 202 instead of through the ESD protection structure 204. In someexamples, the thickness or height in the z-direction of the concealinglayer 218 is 1-100 micrometers (μm), 1-50 μm, 1-25 μm, or 1-10 μm.

In certain examples, a surface layer 220 is positioned on top of thesensor IC 202 (such that the surface layer 220 is exposed to the user ofthe electronic device 200). The surface layer 220 may be configured tomatch the color or be similar in color to the color of the concealinglayer 218 and/or an adjacent layer of the electronic device 200. Thesurface layer 220 may be made of an insulator or non-conductivematerial. In other examples, the surface layer 220 is a conductive layerhaving a conductivity less than a conductivity of the concealing layer.For example, the surface layer 220 may include some level of conductivematerial to provide a matching or similar color to the concealing layer218. The surface layer 220 may be a paint layer having some amount ofconductive carbon within the composition. The amount of conductivematerial within the surface layer composition may be less than 10% byweight carbon, less than 5% by weight carbon, or less than 1% by weightcarbon.

The surface layer 220 may be configured such that the dielectricbreakdown path remains larger for an ESD strike traveling through thesensor IC 202 and surface layer 220 in comparison with the dielectricbreakdown path of an ESD strike traveling through the ESD protectionstructure 204 and concealing layer 218.

As previously noted, the surface layer 220 may be a paint layer. Inalternative examples, the surface layer 220 may be a glass layer. Thesurface layer 220 may have a thickness or height in the z-direction suchthat the sensor IC 202 is not adversely affected (e.g., such thatfingerprint analysis remains functional). In some examples, thethickness or height in the z-direction of the concealing layer 220 is1-100 micrometers (μm), 1-50 μm, 1-25 μm, or 1-10 μm.

As noted, the color of the concealing layer 218 and the color of thesurface layer 220 may be coordinated with each other. In one example,the two layers are made of black paint. Other colors are also possible,and may be chosen based on the color of the surrounding components ofthe electronic device (e.g., red, green, blue, magenta, yellow, cyan).

FIG. 3 depicts an alternative example cross-section of an electronicdevice 300 having a sensor integrated circuit 302 and an electrostaticdischarge (ESD) protection structure 304 surrounding a portion of thesensor IC 302. As depicted in this example, the ESD protection structure304 does not surround the entire perimeter of the sensor IC 302. Thesensor IC 302 is affixed to a substrate 306 via a connecting layer 308(e.g., solder). As such, the sensor IC 302 and substrate 306 both liealong the x-y plane. The substrate 306 may include multiple layers,e.g., a flexible print circuit layer, a riser layer, and/or a stiffeneror backing layer.

One or more layers may be positioned around the sensor IC 302 of theelectronic device 300. As depicted in FIG. 3, a plastic layer 310 ispositioned above the substrate 306. Additionally, a cover layer 312 ispositioned on top of the plastic layer 310. The cover layer 312 may bemade of a fabric. The cover layer 312 may extend over the outer edge 314of the sensor IC 302 (as viewed along the z-axis). Such a configurationmay be advantageous to prevent or limit a user from viewing the ESDprotection structure 304 positioned beneath the cover layer 312.

As depicted in FIG. 3, the ESD protection structure 304 extends fromsubstrate 306 toward the cover layer 312 in the z-direction (e.g.,perpendicular to the x-y plane of the sensor IC 302 and substrate 306).The ESD protection structure 304 may be positioned on or next to thesurface of the internal plastic layer 310. As such, the ESD protectionstructure 304 and sensor IC 302 are not co-planar. The ESD protectionstructure 304 is connected to a ground via an extension 316 of the ESDprotection structure 304. The extension 316 may also be connected oraffixed to the surface of the substrate. The extension 316 may be madeof the same or a different conductive material as the ESD protectionstructure 304.

A concealing layer 318 is positioned over a surface of the ESDprotection structure 304. The concealing layer 318 is configured tovisibly conceal or hide the ESD protection structure 318 from the viewof the user of the electronic device 300. This is advantageous becausethe area of the electronic device 300 at or surrounding the sensor IC302 may appear uniform in color or pattern. In other words, anyundesired appearance, pattern, or color of the ESD protection structure304 (e.g., the color of a metal trace) may be concealed with theconcealing layer 318 to appear uniform in color with the surroundingelectronic components.

The concealing layer 318 may also extend in the z-directionperpendicular to the x-y plane of the sensor IC 302 and substrate 306.In certain examples, the concealing layer 318 may be positioned betweenthe ESD protection structure 304 and the sensor IC 302.

The concealing layer 318 may be made of a conductive material. In oneexample, the concealing layer 318 is a paint layer. The paint layer maybe conductive. The paint layer may be configured to match the color orbe similar in color to the sensor IC surface color and/or the color ofan adjacent layer of the electronic device 300.

The concealing layer 318 may have a thickness or width in thex-direction such that the dielectric breakdown path for the ESDprotection structure 304 and concealing layer 318 remains less than thedielectric breakdown path for the sensor IC 302. In other words, thewidth of the concealing layer 318 (combined with the type of material ofthe concealing layer 138) should not be configured such that current ofan electrostatic discharge strike would travel through the sensor IC 302instead of through the ESD protection structure 304. In some examples,the thickness or width in the x-direction of the concealing layer 318 is1-100 micrometers (μm), 1-50 μm, 1-25 μm, or 1-10 μm.

In certain examples, a surface layer 320 is positioned on the surface ofthe sensor IC 302. The surface layer 320 may be configured to match thecolor or be similar in color to the color of the concealing layer 318and/or the cover layer 312 of the electronic device 300. The surfacelayer 320 may be made of a non-conductive material (or a minimallyconductive material such that the dielectric breakdown path remainslarger for a ESD strike traveling through the sensor IC 302 and surfacelayer in comparison with the dielectric breakdown path of an ESD striketraveling through the ESD protection structure 304 and concealing layer318). For example, the surface layer 220 may be a paint layer havingsome amount of conductive carbon within the composition.

The surface layer 320 may be a paint layer. In alternative examples, thesurface layer 320 may be a glass layer. The surface layer 320 may have athickness or height in the z-direction such that the sensor IC 302 isnot adversely affected (e.g., such that fingerprint analysis remainsfunctional). In some examples, the thickness or height in thez-direction of the concealing layer 320 is 1-100 micrometers (μm), 1-50μm, 1-25 μm, or 1-10 μm.

As noted, the color of the concealing layer 318 and the color of thesurface layer 320 may be coordinated with each other (and, in someexamples, the surrounding cover layer 312). In one example, the twolayers are made of black paint. Other colors are also possible, and maybe chosen based on the color of the surrounding components of theelectronic device (e.g., the surrounding cover layer 312).

Exemplary Computing Environment

With reference to FIG. 4, a cosmetically hidden ESD structure asdescribed above may be incorporated within an exemplary computingenvironment 400. The computing environment 400 may correspond with oneof a wide variety of computing devices, including, but not limited to,personal computers (PCs), server computers, tablet and other handheldcomputing devices, laptop or mobile computers, communications devicessuch as mobile phones, multiprocessor systems, microprocessor-basedsystems, set top boxes, programmable consumer electronics, network PCs,minicomputers, mainframe computers, or audio or video media players. Incertain examples, the computing device may be a wearable electronicdevice, wherein the device may be worn on or attached to a person's bodyor clothing. The wearable device may be attached to a person's shirt orjacket; worn on a person's wrist, ankle, waist, or head; or worn overtheir eyes or ears. Such wearable devices may include a watch,heart-rate monitor, activity tracker, or head-mounted display.

The computing environment 400 has sufficient computational capabilityand system memory to enable basic computational operations. In thisexample, the computing environment 400 includes one or more processingunit(s) 410, which may be individually or collectively referred toherein as a processor. The computing environment 400 may also includeone or more graphics processing units (GPUs) 415. The processor 410and/or the GPU 415 may include integrated memory and/or be incommunication with system memory 420. The processor 410 and/or the GPU415 may be a specialized microprocessor, such as a digital signalprocessor (DSP), a very long instruction word (VLIW) processor, or othermicrocontroller, or may be a general-purpose central processing unit(CPU) having one or more processing cores. The processor 410, the GPU415, the system memory 420, and/or any other components of the computingenvironment 400 may be packaged or otherwise integrated as a system on achip (SoC), application-specific integrated circuit (ASIC), or otherintegrated circuit or system.

The computing environment 400 may also include other components, suchas, for example, a communications interface 430. One or more computerinput devices 440 (e.g., pointing devices, keyboards, audio inputdevices, video input devices, haptic input devices, or devices forreceiving wired or wireless data transmissions) may be provided. Theinput devices 440 may include one or more touch-sensitive surfaces, suchas track pads. Various output devices 450, including touchscreen ortouch-sensitive display(s) 455, may also be provided. The output devices450 may include a variety of different audio output devices, videooutput devices, and/or devices for transmitting wired or wireless datatransmissions.

The computing environment 400 may also include a variety of computerreadable media for storage of information such as computer-readable orcomputer-executable instructions, data structures, program modules, orother data. Computer readable media may be any available mediaaccessible via storage devices 460 and includes both volatile andnonvolatile media, whether in removable storage 470 and/or non-removablestorage 480. Computer readable media may include computer storage mediaand communication media. Computer storage media may include volatile andnonvolatile, removable and non-removable media implemented in any methodor technology for storage of information such as computer readableinstructions, data structures, program modules or other data. Computerstorage media includes, but is not limited to, RAM, ROM, EEPROM, flashmemory or other memory technology, CD-ROM, digital versatile disks (DVD)or other optical disk storage, magnetic cassettes, magnetic tape,magnetic disk storage or other magnetic storage devices, or any othermedium which may be used to store the desired information and which mayaccessed by the processing units of the computing environment 400.

FIG. 5 depicts an example of a computing environment 500 that isoperable to employ the cosmetically hidden ESD structure describedherein. The illustrated environment 100 includes an example of acomputing device 502 that is communicatively coupled to an input device504 via a hinge 506. The computing device 502 may be configured to havea range of processing powers and memory capacities. The computing device502 may also include software that causes the computing device 502 toperform one or more operations.

The computing device 502, for instance, is illustrated as including aninput/output module 508. The input/output module 508 is representativeof functionality relating to processing of inputs and rendering outputsof the computing device 502. A variety of different inputs may beprocessed by the input/output module 508, such as inputs relating tofunctions that correspond to keys of the input device 504, keys of avirtual keyboard displayed by the display device 510 to identifygestures and cause operations to be performed that correspond to thegestures that may be recognized through the input device 504 and/ortouchscreen functionality of the display device 510, and so forth. Thus,the input/output module 508 may support a variety of different inputtechniques.

In the illustrated example, the input device 504 is configured as havingan input portion that includes a keyboard having a QWERTY arrangement ofkeys and track pad although other arrangements of keys are alsocontemplated. Further, other non-conventional configurations are alsocontemplated, such as a game controller, configuration to mimic amusical instrument, and so forth. Thus, the input device 504 and keysincorporated by the input device 504 may assume a variety of differentconfigurations to support a variety of different functionalities.

The input device further includes a trackpad 512 and a fingerprintsensor 514. The fingerprint sensor 514 includes an electrostaticdischarge (ESD) protection structure surrounding at least a portion ofthe fingerprint sensor 514. In some examples, the surface of thetrackpad 512 is at a same height (as measured in the z-direction) as thesurface of the fingerprint sensor 514.

While the present claim scope has been described with reference tospecific examples, which are intended to be illustrative only and not tobe limiting of the claim scope, it will be apparent to those of ordinaryskill in the art that changes, additions and/or deletions may be made tothe disclosed embodiments without departing from the spirit and scope ofthe claims.

The foregoing description is given for clearness of understanding only,and no unnecessary limitations should be understood therefrom, asmodifications within the scope of the claims may be apparent to thosehaving ordinary skill in the art.

Claim Support Section

In a first embodiment, an electronic device comprises an integratedcircuit, an electrostatic discharge (ESD) protection structurepositioned at least partially around a perimeter of the integratedcircuit, the ESD protection structure configured to protect theintegrated circuit from an electrostatic discharge strike; and aconcealing layer positioned on a surface of the ESD protectionstructure, the concealing layer configured to at least partially concealthe ESD protection structure from view.

In a second embodiment, an electronic device comprises a substrate, anintegrated circuit positioned on a surface of the substrate, defining aplane at the surface of the substrate, an electrostatic discharge (ESD)protection structure positioned at least partially around a perimeter ofthe integrated circuit, wherein the ESD protection structure isconfigured to protect the integrated circuit from an electrostaticdischarge strike, and wherein the ESD protection structure extends fromthe substrate in a direction perpendicular to the plane of the surfaceof the substrate, and a concealing layer positioned on a surface of theESD protection structure, wherein the concealing layer is configured toat least partially conceal the ESD protection structure from view, andwherein the concealing layer is positioned between the ESD protectionstructure and the integrated circuit.

In a third embodiment, an input device comprises a fingerprint sensorintegrated circuit, an electrostatic discharge (ESD) protectionstructure positioned at least partially around a perimeter of thefingerprint sensor integrated circuit; the ESD protection structureconfigured to protect the fingerprint sensor integrated circuit from anelectrostatic discharge strike, and a concealing layer positioned on asurface of the ESD protection structure, the concealing layer configuredto at least partially conceal the ESD protection structure from view.

In a fourth embodiment, with reference to any of embodiments 1-3, theintegrated circuit is a fingerprint sensor integrated circuit.

In a fifth embodiment, with reference to any of embodiments 1-4, the ESDprotection structure comprises a metal plated trace.

In a sixth embodiment, with reference to the fifth embodiment, the metalplated trace is a gold plated trace.

In a seventh embodiment, with reference to any of embodiments 1-6, theESD protection structure is a continuous structure positioned around theentire perimeter of the integrated circuit.

In an eighth embodiment, with reference to any of embodiments 1-6, theESD protection structure comprises multiple segments positioned aroundless than the entire perimeter of the integrated circuit.

In a ninth embodiment, with reference to any of embodiments 1-8, theconcealing layer comprises a conductive composition.

In a tenth embodiment, with reference to the ninth embodiment, theconcealing layer is a paint layer.

In an eleventh embodiment, with reference to any of embodiments 1-10,the electronic device further comprises a surface layer positioned on asurface of the integrated circuit such that the surface layer is exposedto a user of the electronic device.

In a twelfth embodiment, with reference to the eleventh embodiment, thesurface layer is a non-conductive layer or comprises a conductivity lessthan a conductivity of the concealing layer.

In a thirteenth embodiment, with reference to the eleventh embodiment orthe twelfth embodiment, the surface layer is a paint layer or a glasslayer.

In a fourteenth embodiment, with reference to any of embodiments 11-13,the surface layer and the concealing layer are a same color.

In a fifteenth embodiment, with reference to the first embodiment or anyof embodiments 3-14, the integrated circuit and the ESD protectionstructure are individually positioned on a substrate layer, eitherdirectly on the substrate layer or through an intermediate solderinglayer, such that the integrated circuit and the ESD protection structureare positioned on a same plane.

In a sixteenth embodiment, with reference to any of embodiments 1-15,the device further comprises a trackpad, wherein a surface of thetrackpad is at a same height as a surface of the fingerprint sensorintegrated circuit.

In a seventeenth embodiment, with reference to any of embodiments 1-16,the device further comprises a keyboard having a plurality of keys,wherein a surface of the plurality of keys of the keyboard is at a sameheight as a surface of the fingerprint sensor integrated circuit.

What is claimed is:
 1. An electronic device comprising: an integratedcircuit; an electrostatic discharge (ESD) protection structurepositioned at least partially around a perimeter of the integratedcircuit, the ESD protection structure configured to protect theintegrated circuit from an electrostatic discharge strike; and aconcealing layer positioned on a surface of the ESD protectionstructure, the concealing layer configured to at least partially concealthe ESD protection structure from view.
 2. The electronic device ofclaim 1, wherein the integrated circuit is a fingerprint sensorintegrated circuit.
 3. The electronic device of claim 1, wherein the ESDprotection structure comprises a metal plated trace.
 4. The electronicdevice of claim 3, wherein the metal plated trace is a gold platedtrace.
 5. The electronic device of claim 1, wherein the ESD protectionstructure is a continuous structure positioned around the entireperimeter of the integrated circuit.
 6. The electronic device of claim1, wherein the ESD protection structure comprises multiple segmentspositioned around less than the entire perimeter of the integratedcircuit.
 7. The electronic device of claim 1, wherein the concealinglayer comprises a conductive composition.
 8. The electronic device ofclaim 7, wherein the concealing layer is a paint layer.
 9. Theelectronic device of claim 1, further comprising: a surface layerpositioned on a surface of the integrated circuit such that the surfacelayer is exposed to a user of the electronic device.
 10. The electronicdevice of claim 9, wherein the surface layer is a non-conductive layeror comprises a conductivity less than a conductivity of the concealinglayer.
 11. The electronic device of claim 9, wherein the surface layeris a paint layer or a glass layer.
 12. The electronic device of claim 9,wherein the surface layer and the concealing layer are a same color. 13.The electronic device of claim 1, wherein the integrated circuit and theESD protection structure are individually positioned on a substratelayer, either directly on the substrate layer or through an intermediatesoldering layer, such that the integrated circuit and the ESD protectionstructure are positioned on a same plane.
 14. An electronic devicecomprising: a substrate; an integrated circuit positioned on a surfaceof the substrate, defining a plane at the surface of the substrate; anelectrostatic discharge (ESD) protection structure positioned at leastpartially around a perimeter of the integrated circuit, wherein the ESDprotection structure is configured to protect the integrated circuitfrom an electrostatic discharge strike, and wherein the ESD protectionstructure extends from the substrate in a direction perpendicular to theplane of the surface of the substrate; and a concealing layer positionedon a surface of the ESD protection structure, wherein the concealinglayer is configured to at least partially conceal the ESD protectionstructure from view, and wherein the concealing layer is positionedbetween the ESD protection structure and the integrated circuit.
 15. Theelectronic device of claim 14, wherein the integrated circuit is afingerprint sensor integrated circuit.
 16. The electronic device ofclaim 14, wherein the ESD protection structure comprises a metal platedtrace.
 17. The electronic device of claim 14, wherein the concealinglayer is a conductive paint layer.
 18. An input device comprising: afingerprint sensor integrated circuit; an electrostatic discharge (ESD)protection structure positioned at least partially around a perimeter ofthe fingerprint sensor integrated circuit; the ESD protection structureconfigured to protect the fingerprint sensor integrated circuit from anelectrostatic discharge strike; and a concealing layer positioned on asurface of the ESD protection structure, the concealing layer configuredto at least partially conceal the ESD protection structure from view.19. The input device of claim 18, further comprising: a trackpad,wherein a surface of the trackpad is at a same height as a surface ofthe fingerprint sensor integrated circuit.
 20. The input device of claim18, further comprising: a keyboard having a plurality of keys, wherein asurface of the plurality of keys of the keyboard is at a same height asa surface of the fingerprint sensor integrated circuit.